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  • DISCO DAC-2SP/86, Automated Dicing Saw
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DISCO DAC-2SP/86, Automated Dicing Saw
Description

High speed saw, waver cutting machine

Fib, SEM, Ibid

Laser

Application

Dicing saw for Silicon wafers

References

\\cleanroomsrv\Data\__Documentation\Dicing Saw (only accesible from AMOLF)

Location

0.47

Specifications

DISCO DAC-2SP/86, Automated Dicing Saw

During dicing, wafers are typically mounted on dicing tape which has a sticky backing that holds the wafer. Once a wafer has been diced, the samples will stay on the dicing tape until they are exposed to UV light to weaken the glue.

Sample size max 6” wafer

Dicing saw thickness ~75 micron

http://en.wikipedia.org/wiki/Wafer_dicing