- Realization of 2-dimensional air-bridge silicon photonic crystals by focused ion beam, milling and nanopolishing
- Influence of hole size on the extraordinary transmission through subwavelength hole arrays
- Raith e-LiNE lithography system
- Delta 80
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High speed saw, waver cutting machine
Fib, SEM, Ibid
Dicing saw for Silicon wafers
\\cleanroomsrv\Data\__Documentation\Dicing Saw (only accesible from AMOLF)
DISCO DAC-2SP/86, Automated Dicing Saw
During dicing, wafers are typically mounted on dicing tape which has a sticky backing that holds the wafer. Once a wafer has been diced, the samples will stay on the dicing tape until they are exposed to UV light to weaken the glue.
Sample size max 6” wafer
Dicing saw thickness ~75 micron